Silicon wafer including amorphous silicon layer formed by PCVD and method of manufacturing wafer
AssigneeShin-Etsu Handotai Co., Ltd.
InventorsShoichi Takamizawa, Norihiro Kobayashi
Life of this patent
Estimating the term…
Abstract
A silicon wafer has an amorphous silicon layer formed on one main surface thereof. The amorphous silicon layer is formed by plasma chemical vapor deposition. The silicon wafer has a gettering layer that possesses high gettering capability and enhanced continuance of the gettering capability. Moreover, the stress acting on the silicon wafer due to the gettering layer is reduced so that the warpage of the silicon wafer decreases. The silicon wafer can be manufactured with high productivity.
Claims5
A method of manufacturing a silicon wafer which has an amorphous silicon layer formed on a first main surface thereof, the first main surface being an etched or mirror-polished surface, said method comprising the step of forming the amorphous silicon layer on the first main surface by plasma chemical vapor deposition.
A method of manufacturing a silicon wafer which has an amorphous silicon layer formed on a first main surface of the silicon wafer opposite to a mirror-finished second main surface of the silicon wafer, the first main surface being an etched or mirror-polished surface, said method comprising the steps of:
- mirror-polishing the second main surface, or the first main surface and the second main surface, of the silicon wafer;
- and
- forming the amorphous silicon layer on the first main surface of the silicon wafer by plasma chemical vapor deposition.
Dependencies are inferred from the claim text.