Injection of encapsulating material on an optocomponent

A method of manufacturing an encapsulated optocomponent by embedding the optocomponent in an encapsulating material, the method comprising the steps of:

• manufacturing the optocomponent having a first surface having guide grooves thereon and the ontocomponent further having a second surface, which is opposite to the first surface;
• placing guide pins in an opened mold cavity of a mold and placing the optocomponent in the opened mold cavity, wherein the guide pins are placed in the opened mold cavity before or after placing the optocomponent in the opened mold cavity to make the guide pins engage the guide grooves, so that the optocomponent is roughly positioned in relation to the guide pins
• closing the opened mold cavity,
• during the placing of the optocomponent in the mold cavity or during or after closing of the mold cavity, applying a force to the second surface of the optocomponent pressing the optocomponent resiliently against the guide pins so that the optocomponent is accurately positioned in relation to the guide pins,
• inserting the encapsulating material into the closed mold cavity
• solidifying the encapsulating material to form a molded body containing the optocomponent,
• opening the closed mold cavity, and
• removing the molded body from the opened mold cavity.