Ultrahigh-frequency electronic component and method of manufacturing the same

A method of manufacturing an ultrahigh-frequency electronic component having an ultrahigh-frequency chip mounted on a lead frame and electrically connected thereto by wire bonding, the ultrahigh-frequency chip being encased by sealing resin, comprising:

• placing the ultrahigh-frequency chip and the lead frame in a first mold cavity of a primary mold die set;
• introducing a first sealing resin into said first mold cavity under a first condition to produce voids in the first sealing resin;
• removing the ultrahigh-frequency chip and the lead frame encased in the solidified first sealing resin from said primary mold die set;
• placing the ultrahigh-frequency chip and the lead frame encased in the solidified first sealing resin in a second mold cavity of a secondary mold die set;
• introducing a second sealing resin into said second mold cavity under a second condition to produce no voids in the second sealing resin in order to encase the first sealing resin encasing said ultrahigh-frequency chip and the lead frame;
• and
• removing the resin encased chip and lead frame from the second die set as the ultrahigh-frequency electronic component.