Method of fabricating a microelectronic package having polymer ESD protection

A method of fabricating a microelectronic package, comprising the steps of:

• providing a lead, an integrated circuit die, a conductive member and material which is normally dielectric and which becomes temporarily conductive upon application thereto of an electrostatic discharge (ESD) potential;
• positioning the die, the lead, the conductive member and the material such that the material forms an ESD conductive path from the lead to the conductive member to provide ESD protection to the die;
• and
• enclosing the die in a protective package with the lead extending out therefrom, and with the ESD conductive path being in the package;
• wherein said providing and positioning steps include:
• forming a flexible tape with the material being a tape substrate thereof, one tape side being patterned to form the lead, and another tape side being patterned to form the conductive member;
• forming a die well in the tape;
• and mounting the integrated circuit die in the die well.

A method of fabricating a microelectronic package, comprising the steps of:

• providing a lead, an integrated circuit die, a conductive member and material which is normally dielectric and which becomes temporarily conductive upon application thereto of an electrostatic discharge (ESD) potential;
• positioning the die, the lead, the conductive member and the material such that the material forms an ESD conductive path from the lead to the conductive member to provide ESD protection to the die;
• and
• enclosing the die in a protective package with the lead extending out therefrom, and with the ESD conductive path being in the package;
• wherein said positioning step includes silk screening the material.

A method of fabricating a microelectronic package, comprising the steps of:

• providing a lead, an integrated circuit die, a conductive member and material which is normally dielectric and which becomes temporarily conductive upon application thereto of an electrostatic discharge (ESD) potential;
• positioning the die, the lead, the conductive member and the material such that the material forms an ESD conductive path from the lead to the conductive member to provide ESD protection to the die;
• and
• enclosing the die in a protective package with the lead extending out therefrom, and with the ESD conductive path being in the package;
• wherein said providing and positioning steps include coating the material and laying a lead frame including the lead on the coated material.

A method of fabricating a microelectronic package, comprising the steps of:

• providing a lead, an integrated circuit die, a conductive member and material which is normally dielectric and which becomes temporarily conductive upon application thereto of an electrostatic discharge (ESD) potential;
• positioning the die, the lead, the conductive member and the material such that the material forms an ESD conductive path from the lead to the conductive member to provide ESD protection to the die;
• and
• enclosing the die in a protective package with the lead extending out therefrom, and with the ESD conductive path being in the package;
• wherein the lead defines a first lead and the conductive member defines a second lead for extending out of the package.