Process of resin sealing a semiconductor device and lead frame

A method of manufacturing a semiconductor device, comprising the steps of:

• (a) forming, in an electrically insulating film having a plurality of edges, a plurality of lead formation regions within a resin sealing region, and a plurality of non-lead-formation regions within said resin sealing region, at least a device hole, a first group of apertures within said resin sealing region, each aperture in said first group formed entirely in a non-lead-formation region between two lead formation regions, and a plurality of second groups of apertures within said resin sealing region, each one of said plurality of second groups including a plurality of apertures within each said lead formation region, and linking portions each formed within said resin sealing region between apertures within each one of said plurality of second groups and each said linking portion formed at approximately 45 degrees to said edges;
• (b) attaching a conductive film to said insulating film and using photolithography etching to form leads within said lead formation regions of said insulating film over said plurality of apertures of each one said second groups and on said linking portions, so that each lead comprises an inner lead portion extending into said device hole and an outer lead linkage portion;
• (c) placing an integrated circuit chip within said device hole and connecting electrodes of said integrated circuit chip to said inner lead portions of said leads;
• (d) superimposing on said insulating film a lead frame having outer leads arranged at the same pitch as said outer lead linkage portions and having a mechanical strength greater than that of said outer lead linkage portions, and connecting said outer lead linkage portions to said outer leads;
• (e) using transfer molding to form a resin sealing portion to seal said integrated circuit chip, said leads, and part of said outer leads in resin;
• and
• (f) before said step (e), forming irregularities on an under-surface of said integrated circuit chip to increase a coupling force between said integrated circuit chip and said resin that forms said resin sealing portion.