Loading patent…
AssigneeCarnegie Mellon University
InventorsL. Richard Carley, Michael L. Reed, Gary K. Fedder, Suresh Santhanam
Estimating the term…
The present invention is directed to a process for fabricating a microelectromechanical device from a substrate carrying at least one layer of a non-erodible material laid out to form at least a portion of the microelectromechanical device, at least one layer of an erodible material, and at least one sacrificial layer. The process includes the step of using the layer of non-erodible material as a mask and anistropically etching any of the layer of erodible material not occluded by the layer of non-erodible material. The process also includes the step of isotropically etching the sacrificial layer under at least a beam portion of the microelectromechanical device to free the beam portion of the microelectromechanical device from the substrate.
A process for fabricating a microelectromechanical device from a substrate carrying at least one layer of a non-erodible material laid out to form at least a portion of said microelectromechanical device, at least one layer of an erodible material, and at least one sacrificial layer, comprising the steps of:
A process for fabricating a microelectromechanical device from a substrate carrying at least one layer of a non-erodible conductive aluminum mask material laid out to form at least a portion of said microelectromechanical device, at least one layer of an erodible insulative oxide material, and at least one polysilicon sacrificial layer, comprising the steps of:
Dependencies are inferred from the claim text.