US 5,970,310 A · Method for manufacturing multilayer wiring board and wiring pattern forming apparatus

Abstract

To form in a batch manner a thin-film wiring pattern in high precision over an entire region of a ceramics multilayer wiring board containing distortion and deformation, a correction amount of the ceramics multilayer wiring board (rotation angle and movement amount of position of this ceramics multilayer wiring board) is calculated in a computer by applying, for instance, the least squares method to positional coordinate values of each of the LSI mounting areas of the ceramics multilayer board and also to positional coordinate values corresponding thereto on a photomask. A support apparatus for supporting the multilayer wiring board is controlled based upon the calculated correction amount, so that the multilayer wiring board can be aligned with respect to the photomask.

Claims15

Dependent claims

A method for manufacturing a multilayer wiring board by forming an insulating film and a wiring pattern on a wiring board, wherein:

image data acquired by imaging a large number of LSI mounting areas provided on the wiring board is processed by a predetermined calculation process to thereby calculate positional coordinate values of said LSI mounting areas;
positional coordinate values of a alignment through hole formed on the wiring board, said calculated positional coordinate values of the LSI mounting areas, positional coordinate values on a photomask, corresponding to each of said LSI mounting areas and functioning as reference positional coordinate values, and also positional coordinate values of a alignment grid formed on said photomask are processed by a predetermined calculation process, whereby a correction amount of said wiring board required for the alignment operation is calculated;
and
the position of said wiring board is relatively moved with respect to said photomask based on said correction amount, whereby the alignment operation of said wiring board with respect to said photomask is carried out.

1 more element

A thin-film wiring pattern forming apparatus comprising:

a controlling computer in which a preselected calculation process is performed for image data acquired by imaging a large number of LSI mounting areas provided on a wiring board so as to calculate positional coordinate values of said LSI mounting areas, and another preselected calculation process is executed for positional coordinate values of alignment through holes formed on the wiring board, said calculated positional coordinate values of said LSI mounting areas, positional coordinate values on a photomask, which corresponds to each of said LSI mounting areas and are equal to reference positional coordinate values, and also positional coordinate values of an alignment grid 5 formed on said photomask, whereby a correction amount of said wiring board required for a alignment operation is calculated;
a board control unit for controlling a board support base for supporting said wiring board based on said correction amount to thereby relatively move the position of said wiring board with respect to said photomask;
and
an exposing unit for exposing said wiring board through said photomask.

1 more element

A method for forming a thin-film wiring pattern by repeatedly executing plural times a step for forming an insulating film made of an organic insulating material on a multilayer wiring board, and a step for forming a conductor pattern made of a conductive member on said insulating film, wherein:

said step for forming the insulating film includes a step for aligning said multilayer wiring board with respect to a photomask, and a step for performing an exposing operation via said photomask;
and
said step for aligning said multilayer wiring board with respect to said photomask is performed by making an alignment through hole formed in said multilayer wiring board coincident with an optimum position with respect to an alignment grid pattern formed on said photomask.

Dependencies are inferred from the claim text.

Method for manufacturing multilayer wiring board and wiring pattern forming apparatus

Life of this patent

Method for manufacturing multilayer wiring board and wiring pattern forming apparatus

Life of this patent

Abstract

Claims15