Integral design features for heatsink attach for electronic packages
AssigneeInternational Business Machines Corporation
InventorsEric Arthur Johnson, Stephen John Kosteva, Stephen Wesley MacQuarrie
Life of this patent
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Abstract
An apparatus and method attaching a heatsink to a surface of an electronic package comprising a substrate, an integrated circuit chip attached to the surface of the substrate, an encapsulant encapsulating the integrated circuit chip and contacting at least a portion of the surface of the substrate, and an orifice formed in the top portion of the encapsulant to attach the heatsink to the surface of the electronic package. The heatsink may be attached and removed as desired to allow for package identification or rework.
Claims18
An electronic package assembly comprising:
- a substrate having a first surface and a second surface;
- an integrated circuit chip having a top surface;
- first attaching means for attaching the integrated circuit chip to the first surface of the substrate;
- an overmold formed on the top surface of the integrated circuit chip and on the first surface of the substrate for encapsulating the integrated circuit chip, the overmold contacting at least a portion of the first surface of the substrate and having a top portion;
- orifices formed in the top portion of the overmold;
- and
- attaching members having an upper portion and a bottom portion, the attaching members detachably coupled to respective ones of the orifices at the bottom portion of the attaching members.
An electronic package assembly comprising:
- a substrate having a first surface and a second surface;
- a flip-chip having a top surface and a bottom surface;
- first attaching means for attaching the flip-chip to the first surface of the substrate;
- encapsulating means for encapsulating the flip chip, the encapsulating means contacting at least a portion of the first surface of the substrate and having an upper portion;
- second attaching means formed along the upper portion of the encapsulating means;
- and
- attaching members having an upper portion and a bottom portion, the attaching members detachably coupled to the second attaching means at the bottom portion of the attaching members.
A method for packaging an electronic assembly comprising the steps of:
- (a) attaching an integrated circuit chip to a first surface of a substrate using a first attachment,
- (b) encapsulating the integrated circuit chip using an encapsulant contacting the integrated circuit chip and at least a portion of the first surface of the substrate,
- (c) forming orifices in only a top portion of the encapsulant, and
- (d) detachably attaching a heat dissipater to the encapsulant using a third attachment, the third attachment coupled to the orifices formed in only the top portion of the encapsulant.
An electronic package assembly comprising:a
- a substrate having a first surface and a second surface;
- an integrated circuit chip having a top surface;
- first attaching means for attaching the integrated circuit chip to the first surface of the substrate;
- encapsulating means for encapsulating the integrated circuit chip, the encapsulating means contacting at least a portion of the first surface of the substrate and having a top portion;
- second attaching means formed in only the top portion of the encapsulating means;
- and
- attaching members having an upper portion and a bottom portion, the attaching members detachably coupled to the second attaching means at the bottom portion of the attaching members.
Dependencies are inferred from the claim text.