Temperature measuring device
AssigneeLockheed Martin Energy Research Corporation
InventorsRobert J. Lauf, Don W. Bible, Carl W. Sohns
Life of this patent
Estimating the term…
Abstract
Systems and methods are described for a wireless instrumented silicon wafer that can measure temperatures at various points and transmit those temperature readings to an external receiver. The device has particular utility in the processing of semiconductor wafers, where it can be used to map thermal uniformity on hot plates, cold plates, spin bowl chucks, etc. without the inconvenience of wires or the inevitable thermal perturbations attendant with them.
Claims32
A temperature measurement device, comprising:
- a silicon semiconductor wafer;
- a solid-state temperature sensor mounted on said silicon semiconductor wafer;
- and
- a signal transmitter adapted to transmit an output signal of said solid-state temperature sensor to an external receiver from approximately -65.degree. C., to approximately 200.degree. C., said signal transmitter and said solid-state temperature sensor composing a set of integrated circuits disposed directly upon said silicon semiconductor wafer.
The device of claime 3, wherein said power source includes a thin film device selected from the group consisting of a battery, a capacitor, an inductive pick-up, and a photovoltaic device.
A system for measuring temperatures at various locations and times in a silicon semiconductor wafer processing environment, comprising:
- a temperature measuring device comprising:
- a silicon semiconductor wafer;
- a solid-state temperature sensor mounted on said silicon semiconductor wafer;
- a signal transmitter adapted to transmit an output signal of said temperature sensor to an external receiver from approximately -65.degree. C. to approximately 200.degree. C., said signal transmitter and said temperature sensor composing a set of integrated circuits disposed directly upon said silicon semiconductor wafer;
- an external receiver located outside said silicon semiconductor wafer processing environment, said external receiver adapted to receive said output signal from said signal transmitter;
- and
- an external data processing device coupled to said external receiver, said external data processing device adapted to convert said output signal into useful information for a function selected from the group consisting of display, storage, and retrieval.
A method, comprising:
- sensing a temperature on a silicon semiconductor wafer with a solid-state temperature sensor that is mounted on said silicon semiconductor wafer;
- and
- transmitting an output signal of said solid-state temperature sensor from approximately -65.degree. C. to approximately 200.degree. C., to an external receiver from a signal transmitter, said signal transmitter and said solid-state temperature sensor composing a set of integrated circuits disposed directly upon said silicon semiconductor wafer.
Dependencies are inferred from the claim text.