Probe card and LSI test method using probe card

Abstract

A probe card which solves a problem involved in conventional probe cards in that the yield of the LSIs is reduced because non-defectives can be misjudged as defectives, which is due to failure of test signal application to LSIs owing to a contact failure between probe needles and bonding pads, which in turn due to the lack of needle pressure resulting from the lack of thickness of the probe needles in the conventional probe cards. The present probe card device includes units, each of which has a plurality of probe needles juxtaposed on a first insulating sheet, and separated by second insulating sheets with a thickness of about 10 .mu.m. The units are stacked in multilayer and fixed to a probe card substrate. The first insulating sheet has many grooves to which the second insulating sheets can be inserted. The grooves are formed on the first insulating sheet at intervals smaller than the thickness of the probe needles, and the second insulating sheets are inserted into the grooves at intervals corresponding to the thickness of the probe needles.

Dependencies are inferred from the claim text.