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US 5,969,427 AGranted
Use of an oxide surface to facilitate gate break on a carrier substrate for a semiconductor device
AssigneeMicron Technology, Inc.
InventorRichard W. Wensel
Life of this patent
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Abstract
An encapsulant molding technique used in chip-on-board encapsulation wherein an oxidizable metal layer is patterned on a substrate and the oxidizable metal layer is oxidized to facilitate removal of unwanted encapsulant material. The oxidizable metal layer which adheres to the substrate is applied over a specific portion of the substrate. The oxidizable metal layer is oxidized to form a metal oxide layer which does not adhere to encapsulant materials.
Claims6
A carrier assembly comprising:
- a carrier substrate;
- a semiconductor device attached to and in electrical communication with said carrier substrate;
- and
- an oxide-surfaced path formed on and abutting said carrier substrate, said oxide-surfaced path extending from a location proximate said semiconductor device to a periphery of said carrier substrate.
1 more element
A chip-on-board assembly comprising:
- a carrier substrate;
- at least one semiconductor device attached to and in electrical communication with said carrier substrate, wherein an encapsulant material encases said at least one semiconductor device;
- and
- an oxide-surfaced path formed on and abutting said carrier substrate, said oxide-surfaced path extending from a location proximate a periphery of said encapsulant material encasing said at least one semiconductor device to a periphery of said carrier substrate.
1 more element
Dependencies are inferred from the claim text.