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US 5,969,416 AGranted
Ball grid array semiconductor package
AssigneeSamsung Aerospace Industries, Ltd.
InventorYung-joon Kim
Life of this patent
Estimating the term…
Abstract
A ball grid array semiconductor package including a semiconductor chip, at least one lead having one end attached to the semiconductor chip and other end bent at a predetermined angle, a wire connecting the bent lead to an electrode formed on the semiconductor chip, a first bump attached to a bent end portion of the bent lead, and a resin molding enclosing the semiconductor chip, the lead and the wire to allow one side surface of the bump to be exposed out of the resin molding.
Claims6
A ball grid array semiconductor package comprising:
- a semiconductor chip;
- at least one lead having one end attached to said semiconductor chip and other end bent at an angle;
- at least one straight lead having one end attached to said semiconductor chip;
- a wire connecting said lead to an electrode formed on said semiconductor chip;
- a first bump formed at said bent lead;
- a second bump formed at said straight lead;
- and
- a resin molding enclosing said semiconductor chip, said bent lead, said straight lead and said wire to allow a side surface of said first bump and said second bump to be exposed out of said resin molding, wherein said first bump is exposed through a side surface of said resin molding and said second bump is exposed through a bottom surface of said resin molding.
5 more elements
Dependencies are inferred from the claim text.