Data carrier with a component-containing module and with a coil, method of producing such a data carrier and module therefor

A method of manufacturing a data carrier, in which a data carrier body is manufactured, which data carrier body is bounded by a body surface and in which during the manufacture of the data carrier body a coil having coil turns and at least two coil connecting contacts is incorporated in the data carrier body, which coil turns, at least in their area adjacent a component after the method has been completed, are arranged in a winding level zone which is situated outside a component level zone of the component and extends transversely to said body surface, and the coil connecting contacts together with the coil turns are arranged in the winding level zone, and in which a module is incorporated in the data carrier body, which module comprises a plate-shaped carrier, which is bounded by a first carrier main surface and by a second carrier main surface substantially parallel to the first carrier main surface, and the component, which is connected to the carrier and is raised with respect to the second carrier main surface, and at least two module connecting contacts connected to the carrier and arranged in the area of the second carrier main surface, the first carrier main surface then facing said body surface and the second carrier main surface being remote from said body surface and the component then being disposed in its component level zone which extends transversely to said body surface, and each module connecting contact and each coil connecting contact then being disposed opposite one another in a direction transverse to the second carrier main surface and being connected in an electrically conductive manner, and in which for incorporation in the data carrier body a module is used whose module connecting contacts project beyond the level of the component of the module, and the module connecting contacts are passed through the component level zone up to the coil connecting contacts, which are disposed in the winding level zone, and are connected to the coil connecting contacts so as to form an electrically conductive connection, and in which a recess which terminates in said body surface is formed in the data carrier body, characterized in that during the manufacture of the data carrier body the coil turns and the coil connecting contacts are formed on a carrier foil and subsequently the carrier foil, with the coil turns and the coil connecting contacts of the coil formed on it, is stacked with at least one further foil, the coil turns and the coil connecting contacts of the coil then being interposed between the carrier foil and a cover foil, and subsequently the stacked foils are laminated by means of a lamination process in order to form the data carrier body and subsequently the recess is formed in the manufactured data carrier body by means of a material removal process, and in a bottom area of the recess, which bottom area is remote from said body surface, at least two passages, which extend from the bottom area of the recess up to the coil connecting contacts, are formed, preferably also by means of the same material removal process, and the module connecting contacts are connected to the coil connecting contacts through the passages so as to form an electrically conductive connection.