Semiconductor device having a tab chip on a tape carrier with lead wirings provided on the tape carrier used as external leads

A semiconductor package, comprising:

• a tape carrier comprising an insulating film and lead wirings provided on said insulating film, the lead wirings comprising plural leads each having an inside terminal part serving as an internal lead and an outside terminal part extending from the inside terminal part concurrently serving as external leads;
• a semiconductor chip electrically bonded to said inside terminal part so as to be supported on the tape carrier, the semiconductor chip being sealed with resin;
• and
• an aluminum nitride substrate having a shape of a single sheet said semiconductor chip in combination with said tape carrier, wherein said aluminum having a metallized part for bonding said semiconductor chips,
• wherein an outer peripheral part of said tape carrier is fast bonded to said aluminum nitride substrate through an insulating adhesive agent, said semiconductor chip is bonded to the metallized part of said aluminum nitride substrate, and the outside terminal part of the lead wiring protrudes to the outer side of the aluminum nitride substrate.