Semiconductor IC device having chip support element and electrodes on the same surface

A semiconductor device comprising:

• a semiconductor element having electrodes on a principal surface thereof;
• leads connected with the electrodes;
• a chip support, an upper surface of which is disposed outside an edge of the semiconductor element to be substantially in a same plane as said principal surface of the semiconductor element;
• and
• the leads are bent toward the semiconductor element outside the edge of the semiconductor element.

A semiconductor device comprising:

• a semiconductor element having electrodes on a principal surface thereof;
• leads disposed, being apart from said principal surface of the semiconductor element;
• a chip support attached to said principal surface of the semiconductor element, and disposed substantially in a same plane as the leads;
• and
• wires for connecting the electrodes and the leads.

A semiconductor device comprising:

• a semiconductor element having electrodes on a principal surface thereof;
• a plurality of leads each connected with the electrodes;
• and
• a chip support fixed on said principal surface of the semiconductor element by an insulating tape.