High withstand voltage semiconductor device
AssigneeKabushiki Kaisha Toshiba
InventorsTakashi Shinohe, Yoshihiro Minami, Ichiro Omura
Life of this patent
Estimating the term…
Loading patent…
AssigneeKabushiki Kaisha Toshiba
InventorsTakashi Shinohe, Yoshihiro Minami, Ichiro Omura
Estimating the term…
A semiconductor device includes a first semiconductor layer of a first conductivity type having first and second main surfaces, a second semiconductor layer of a second conductivity type selectively formed on the first main surface of the first semiconductor layer, the second semiconductor layer including a first region having a relatively high injection efficiency and a second region having a relatively low injection efficiency and the first region being surrounded by the second region, a third semiconductor layer of the first conductivity type formed on the second main surface of the first semiconductor layer, a first electrode selectively formed on the second semiconductor layer of the second conductivity type and connected to at least the first region, and a second electrode formed on the third semiconductor layer of the first conductivity type.
A high-withstanding voltage semiconductor device comprising:
Dependencies are inferred from the claim text.