Lateral thin-film SOI devices with graded top oxide and graded drift region
AssigneePhilips Electronics North America Corporation
InventorsTheodore Letavic, Mark Simpson
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AssigneePhilips Electronics North America Corporation
InventorsTheodore Letavic, Mark Simpson
Estimating the term…
A lateral thin-film Silicon-On-Insulator (SOI) device includes a lateral semiconductor device such as a diode or MOSFET provided in a thin semiconductor film on a thin buried oxide. The lateral semiconductor device structure includes at least two semiconductor regions separated by a lateral drift region. A top oxide insulating layer is provided over the thin semiconductor film and a conductive field plate is provided on the top oxide insulating layer. In order to provide enhanced device performance, a portion of the top oxide layer increases in thickness in a substantially continuous manner, while a portion of the lateral drift region beneath the top oxide layer decreases in thickness in a substantially continuous manner, both over a distance which is at least about a factor of five greater than the maximum thickness of the thin semiconductor film.
A lateral thin-film Silicon-On-Insulator (SOI) device comprising a semiconductor substrate, a thin buried oxide insulating layer on said substrate, and a lateral semiconductor device provided in a thin semiconductor film on said thin buried oxide, said thin semiconductor film comprising a first region of a first conductivity type, a second region of a second conductivity type opposite to that of the first and spaced apart from said first region by a lateral drift region of said second conductivity type, a top oxide insulating layer over said thin semiconductor film, and a conductive field plate on said top oxide insulating layer, characterized in that said top oxide insulating layer comprises a layer portion adjacent said first region which increases in thickness in a substantially continuous manner in a direction from said first region toward said second region over a distance of at least about a factor of five times greater than a maximum thickness of said thin semiconductor film, and said lateral drift region comprises a region portion adjacent said first region which decreases in thickness in said substantially continuous manner in a direction from said first region toward said second region over a like distance of at least about a factor of five times greater than a maximum thickness of said thin semiconductor film.
Dependencies are inferred from the claim text.