Semiconductor device with unbreakable testing elements for evaluating components and process of fabrication thereof
AssigneeNEC Corporation
InventorMasanobu Zenke
Life of this patent
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Abstract
Testing elements are disposed to prevent breakage by locating them such that their entire lower surface is formed directly on an insulating layer of a semiconductor device. These testing elements may be used with a fin type storage node electrode projecting from an inter-level insulating layer so as to use the top, side and back surfaces thereof for accumulation of electric charge. These testing elements may be used for evaluating properties of the layers of the storage node electrode and be concurrently formed directly on the inter-level insulating layer, thereby preventing the testing elements from undesirable breakage.
Claims7
A semiconductor device fabricated on a semiconductor substrate, comprising:
- an inter-level insulating structure formed over a major surface of said semiconductor substrate;
- at least one circuit component formed on a first area of an upper surface of said inter-level insulating structure, and having a first member projecting from said first area of said inter-level insulating structure;
- at least one testing element having a lower surface and at least one second member;
- wherein said second member is held in contact with a second area of said upper surface of said inter-level insulating structure and used for evaluating said first member of said at least one circuit component;
- and
- wherein said lower surface is disposed completely in contact with at least one of said upper surface of said inter-level insulating structure and said semiconductor substrate.
Dependencies are inferred from the claim text.