Ball grid array having no through holes or via interconnections
AssigneeInternational Business Machines Corporation
InventorJames Warren Wilson
Life of this patent
Estimating the term…
Abstract
An electronic device package in the form of a ball grid array package is formed adding a single layer of conductive material including circuitry having trace lines, wire bond pads, and solder ball pads electrically coupled together. Thin film circuitization techniques are used on a polyimide laminate substrate to accommodate greater than 100 input/output contacts of an electronic device on a single layer. Thus, the package will not have vias or other conductive type through holes as in multiple conductive layer ball grid array packages.
Claims19
A method of packaging an electronic device, comprising the steps of:
- providing a substrate comprising a laminate containing reinforcing material and having a first surface and an opposed second surface;
- forming a single layer of electrically conductive circuitry on the first surface of the substrate
- by vacuum metallization and wherein said single layer is less than 0.5 mil thickness and includes conductive trace lines having a width less than 1 mil;
- and
- wherein said substrate is free of through holes or vias for interconnections for the single layer of electrically conductive circuitry;
- providing an opening in the substrate for receiving the electronic device;
- securing a thermally conductive member to a second surface of the substrate;
- securing the electronic device to the thermally conductive member such that the electronic device is positioned within the opening in the substrate;
- and
- electrically coupling the electronic device to wire bond pads located on said first surface.
The method as in clam 1, wherein the step of providing a substrate includes a step of providing a substrate made of an organic material.
Dependencies are inferred from the claim text.