Forced plug processing for high aspect ratio structures
AssigneeInternational Business Machines Corporation
InventorsGlenn W. Gale, Bernadette Pierson, William Syverson
Life of this patent
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Abstract
A forced plug process for high aspect ratio structures. The process comprises the steps of providing a liquid plug in a high aspect ratio structure; increasing a gas pressure to force the liquid plug down into the high aspect ratio structure; and suddenly decreasing the gas pressure allowing the liquid plug to be ejected from the high aspect ratio structure. The process is useful for removing unwanted particles from a high aspect ratio structure, as well as for etching and coating the side walls of the structure.
Claims19
A process for treating high aspect ratio structures comprising the steps of:
- A. providing a substrate having a surface and at least one opening with a high aspect ratio in the surface;
- B. providing a liquid plug in the opening;
- C. increasing a gas pressure near the opening for moving the liquid plug in a first direction through the opening;
- and
- D. decreasing the gas pressure near the opening for moving the liquid plug in a second direction through the opening.
A process for treating high aspect ratio structures comprising the steps of:
- A. providing a substrate having a surface and at least one opening with a high aspect ratio in the structure
- B. applying a pressure of approximately 2.times. ambient to the high aspect ratio structure;
- C. providing a liquid plug in the opening by depositing a thin liquid film onto the substrate surface and increasing a gas pressure near the opening to approximately 3.times. to 4.times. ambient pressure;
- D. increasing the gas pressure to approximately 5.times. to 1000.times. ambient pressure for moving the lquid plug in a first direction through the opening;
- and
- E. decreasing the gas pressure near the opening for moving the liquid plug in a second direction through the opening and ejecting a portion of the liquid plug from the opening.
A process for treating high aspect ratio structures comprising the steps of:
- A. providing a substrate having a surface and at least one opening with a high aspect ratio in the structure;
- B. applying a pressure of approximately 2.times. ambient to the high aspect ratio structure;
- C. providing a liquid plug in the opening by depositing a thin liquid film onto the substrate surface and increasing a gas pressure near the opening to approximately 3.times. to 4.times. ambient pressure;
- D. increasing the gas pressure to approximately 5.times. to 1000.times. ambient pressure near the opening of the structure for moving the liquid plug in a first direction through the opening, wherein the gas has a low solubility in the liquid plug;
- and
- E. decreasing the gas pressure near the opening for moving the liquid plug in a second direction through the opening and ejecting a portion of the liquid plug from the opening.
Dependencies are inferred from the claim text.