Method of forming a wafer level contact sheet having a permanent z-axis material
AssigneeW. L. Gore & Associates, Inc.
InventorsJohn J. Budnaitis, Jimmy Leong
Life of this patent
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Abstract
The present invention relates to a system and method for performing reliability screening on semi-conductor wafers and particularly to a highly planar burn in apparatus and method for uses including wafer level burn-in (WLBI), diced die burn-in (DDBI), and packaged die burn-in (PDBI). The burn-in system includes a burn-in substrate with a planar base, a temporary Z-axis connecting member, and a Z-axis wafer level contact sheet electrically coupled to one another for screening wafers, diced die, and packaged electronic components, their assembly and use.
Claims57
A method of forming a wafer level contact sheet comprising:
- a) providing a z-axis, selectively conductive material containing an adhesive;
- and
- b) laminating a first dielectric material having a conductive blind via formed in an upper surface of said dielectric material to a lower surface of said z-axis material for forming a laminated substrate.
A method of forming a wafer level contact sheet comprising:
- a) providing a z-axis, selectively conductive material containing an adhesive;
- b) placing said z-axis material between a first member and a second member, said first member comprising a first dielectric material having an upper surface located conductive via and conductive pad on a lower surface of said dielectric material coupled to said conductive via, and said second member comprising a second dielectric material having a conductive blind via formed in an upper surface of said second dielectric material;
- and laminating said first and second members to one another with said adhesive containing z-axis material.
A method of forming a wafer level contact sheet comprising:
- laminating at least one, downwardly depending, uniformly configured bump having a free planar tip to a lower surface of a z-axis material, said z-axis layer containing irregularly configured conductive pathways, said pathways being electrically isolated from one another in X and Y axes direction and extending from one side of the z-axis layer to another side of said z-axis layer.
A method of forming a wafer level contact sheet comprising:
- providing a first member having an upper z-axis layer and at least one, downwardly depending, uniformly configured bump having a free planar tip and coupling an upper surface of said first member to conductive pads of an electronic component.
Dependencies are inferred from the claim text.