Method for manufacturing thermal-type infrared sensor
AssigneesDirector General, Technical Research and Development Institute, Japan Defense Agency, NEC Corporation
InventorsHideo Wada, Mitsuhiro Nagashima, Tokuhito Sasaki, Naoki Oda
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Abstract
In a method of manufacturing a thermal-type infrared sensor including a thermosensitive part, a bolometer material is formed as the thermosensitive part and is subjected to post-processing to control a temperature coefficient of resistance in the bolometer material. The bolometer material may be formed by titanium or vanadium.
Claims2
A method for producing a thermal-type infrared sensor having a thermosensitive part formed by a bolometer material and an infrared absorption film, the bolometer material having a temperature coefficient of resistance and being formed from a material selected from the group consisting of titanium, titanium oxide, vanadium, and vanadium oxide including an oxygen content less than in VO.sub.2, the method comprising the steps of:
- forming said thermnosensitive part;
- and
- carrying out a heat treatment of said bolometer material in a reduction atmosphere containing a hydrogen gas to control the temperature coefficient.
A method for producing a thermal-type infrared sensor having a thermosensitive part formed by a bolometer material, the bolometer material having a temperature coefficient of resistance, the method comprising the steps of:
- forming said thermosensitive part;
- carrying out a heat treatment of said bolometer material within a chamber kept in a reduction atmosphere including, as a reduction gas, a mixture of argon and hydrogen gas, with the reduction gas being caused to flow into the chamber at a constant flow rate;
- and
- controlling a charged pressure in said chamber to thereby control the resistivity of the bolometer material with the temperature coefficient kept substantially unchanged.
Dependencies are inferred from the claim text.