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AssigneeVacuum Metallurgical Co., Ltd.
InventorsKazuhiro Watanabe, Michihiro Oshima, Kazuhiro Setoguchi, Masaaki Oda
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A metal paste comprising ultrafine particles of a metal. The particles have a particle size of 1000 angstroms (0.1 micron) or less and are individually uniformly dispersed in an organic solvent. A process for producing a metal paste comprises the steps of evaporating a metal in a vacuum chamber in an atmosphere of an inert gas at a pressure of 10 Torr or less and of collecting the vapor of the evaporated metal on a cooling surface in the form of ultrafine particles having a particle size of 1000 angstroms (0.1 micron) or less, wherein a vapor of an organic solvent is introduced into the vacuum chamber while the metal is being evaporated. A method for preparing a metallic thin film having a thickness of between 0.01 micron and 1 micron uses a metal paste containing ultrafine metal particles having a diameter of 0.1 micron or less uniformly dispersed in an organic solvent. In the method, the metal paste is coated on a substrate, dried and sintered.
A method of making a metallic thin film with a metallic paste, said metallic thin film having a range of film thicknesses between 0.01 micron and 1 micron, comprising coating on a substrate a metal paste containing ultrafine metal particles having a diameter of 0.1 micron or less uniformly dispersed in an organic solvent, and drying and sintering the paste on said substrate, in which said ultrafine metal particles comprise at least one metal selected from the group consisting of silver, gold, nickel, indium, tin, zinc, titanium, copper, chromium, tantalum, tungsten, palladium, platinum, iron, cobalt, rhodium, iridium, ruthenium and osmium and an alloy of said metals, and said organic solvent is a solvent containing one or more alcohols having 5 carbon atoms or more, or a solvent containing one or more organic esters.
Dependencies are inferred from the claim text.