# US 5,966,323 A · Low switching field magnetoresistive tunneling junction for high density arrays

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- Number: US 5,966,323 A
- Document ID: US5966323A
- Status: Granted
- Kind: A
- Application number: 08/993,768
- Filed: 1997-12-18
- Granted: 1999-10-12
- Earliest claimed: 1997-12-18
- Assignees: Motorola, Inc.
- Inventors: Eugene Chen; Mark Durlam; Saied N. Tehrani
- Web page: https://patentgrep.com/patent/US5966323A

## CPC

- G11C 11/161: {details concerning the memory cell structure, e.g. the layers of the ferromagnetic memory cell}
- G11C 11/1659: {Cell access}
- G11C 11/1675: {Writing or programming circuits or methods}
- G11C 11/5607: {using magnetic storage elements}
- G11C 2211/5615: Multilevel magnetic memory cell using non-magnetic non-conducting interlayer, e.g. MTJ
- G11C: STATIC STORES (semiconductor memory devices H10B)

## Abstract

A low switching field magnetoresistive tunneling junction memory cell including a first exchange coupled structure having a pair of magnetoresistive layers and an exchange interaction layer sandwiched therebetween so as to pin the magnetic vectors of the pair of layers anti-parallel, a second exchange coupled structure having a pair of magnetoresistive layers and an exchange interaction layer sandwiched therebetween so as to pin the magnetic vectors of the pair of layers anti-parallel, and electrically insulating material sandwiched between the first and second exchange coupled structures to form a magnetoresistive tunneling junction. Each of the first and second exchange coupled structures, and hence the memory cell, has no net magnetic moment.

## Claims

### Claim 1

A low switching field magnetoresistive tunneling junction memory cell comprising:
a first exchange coupled multi-layer structure including a pair of magnetoresistive layers having an exchange interaction layer situated in parallel juxtaposition between the pair of magnetoresistive layers, the pair of magnetoresistive layers each having a magnetic vector and the magnetic vectors always being pinned anti-parallel by coupling of the exchange interaction layer;
a second exchange coupled multi-layer structure including a pair of magnetoresistive layers having an exchange interaction layer situated in parallel juxtaposition between the pair of magnetoresistive layers, the pair of magnetoresistive layers each having a magnetic vector and the magnetic vectors always being pinned anti-parallel by coupling of the exchange interaction layer; and
electrically insulating material situated in parallel juxtaposition between the first and second exchange coupled multi-layer structures to form a magnetoresistive tunneling junction.

### Claim 2 (depends on 1)

A low switching field magnetoresistive tunneling junction memory cell as claimed in claim 1 wherein the first and second exchange coupled multi-layer structures each have a length/width ratio in a range of 1 to 5.

### Claim 3 (depends on 2)

A low switching field magnetoresistive tunneling junction memory cell as claimed in claim 2 wherein the first and second exchange coupled multi-layer structures each have a top plan that is one of circular, diamond-shaped, or elliptical.

### Claim 4 (depends on 1)

A low switching field magnetoresistive tunneling junction as claimed in claim 1 including in addition antiferromagnetic material positioned adjacent one of the first and second exchange coupled multi-layer structures so as to uni-directionally fix the magnetic vectors in the one of the exchange coupled multi-layer structures.

### Claim 5 (depends on 4)

A low switching field magnetoresistive tunneling junction memory cell as claimed in claim 4 wherein the antiferromagnetic material includes FeMn, NiMn, IrMn, or combinations thereof.

### Claim 6 (depends on 1)

A low switching field magnetoresistive tunneling junction memory cell as claimed in claim 1 including in addition flux closure material positioned to enclose exposed edges of the first exchange coupled multi-layer structure.

### Claim 7 (depends on 1)

A low switching field magnetoresistive tunneling junction memory cell as claimed in claim 1 including in addition flux closure material positioned to enclose exposed edges of the second exchange coupled multi-layer structure.

### Claim 8

A high density array of low switching field magnetoresistive tunneling junction memory cells comprising:
a substrate with a planar surface; and
a plurality of interconnected low switching field magnetoresistive tunneling junction memory cells supported on the planar surface of the substrate and interconnected to form a memory array, each cell of the plurality of cells having an aspect ratio less than 5 and a top plan that is one of circular, diamond-shaped, or elliptical, each cell including
a first exchange coupled multi-layer structure with no net magnetic moment including a pair of magnetoresistive layers having an exchange interaction layer situated in parallel juxtaposition between the pair of magnetoresistive layers, the pair of magnetoresistive layers each having a magnetic vector and the magnetic vectors always being pinned anti-parallel by coupling of the exchange interaction layer,
a second exchange coupled multi-layer structure with near zero magnetic moment including a pair of magnetoresistive layers having an exchange interaction layer situated in parallel juxtaposition between the pair of magnetoresistive layers, the pair of magnetoresistive layers each having a magnetic vector and the magnetic vectors always being pinned anti-parallel by coupling of the exchange interaction layer, and
electrically insulating material situated in parallel juxtaposition between the first and second exchange coupled multi-layer structures to form a magnetoresistive tunneling junction with near zero magnetic moment.

### Claim 9 (depends on 8)

A high density array of low switching field magnetoresistive tunneling junction memory cells as claimed in claim 8 wherein the substrate includes a layer of antiferromagnetic material defining the planar surface and the plurality of interconnected low switching field magnetoresistive tunneling junction memory cells are positioned thereon so as to uni-directionally fix the magnetic vectors in an adjacent one of the exchange coupled multi-layer structures.

### Claim 10 (depends on 9)

A high density array of low switching field magnetoresistive tunneling junction memory cells as claimed in claim 9 wherein the layer of antiferromagnetic material includes FeMn, NiMn, IrMn, or combinations thereof.

### Claim 11 (depends on 8)

A high density array of low switching field magnetoresistive tunneling junction memory cells as claimed in claim 8 including in addition flux closure material positioned to enclose exposed edges of the first exchange coupled multi-layer structure in each cell of the plurality of cells.

### Claim 12 (depends on 8)

A high density array of low switching field magnetoresistive tunneling junction memory cells as claimed in claim 8 including in addition flux closure material positioned to enclose exposed edges of the second exchange coupled multi-layer structure in each cell of the plurality of cells.
