Minimal length computer backplane

Abstract

An electrical interconnection structure. The electrical interconnection structure includes a mother board substrate having a plurality of layers. At least one layer includes a signal path having a characteristic impedance of Z.sub.O and a conductive ground plane. A signal via passes through each layer of the mother board substrate. The signal via electrically is connected to the signal path. A ground via passes through each layer of the mother board substrate. The ground via is electrically connected to the conductive ground plane. The electrical interconnection structure further includes a plurality of flex circuits. Each flex circuit includes a flex signal path having a characteristic impedance of Z.sub.O and a flex ground plane. Each flex signal path is electrically connected to the signal via and each flex ground plane is electrically connected to the ground via. The connections between the flex signal path and the signal via, and between the flex ground plane and the ground via can be permanent or separable.

Dependencies are inferred from the claim text.