Cooling system for thin profile electronic and computer devices

An apparatus cooling an integrated circuit package assembly located within a portable computer chassis, said apparatus comprising:

• a heat exchanger comprising:
• an air duct having a thin cross-section relative to the width of said duct, said air duct comprising a housing having facing first and second major internal surfaces and an array of fins disposed between said first and second surfaces, said housing further comprising an inlet port disposed at or near a center portion of said air duct and first and second exit ports disposed at respective opposite first and second end portions of said duct;
• and
• an air flow generator coupled to said inlet port for producing a first and a second air flow, said first air flow being directed from said inlet port to said first exit port, said second air flow being directed from said inlet port to said second exit port;
• a heat pipe having an evaporator portion and a condenser portion, said integrated circuit package being thermally coupled to said evaporator portion;
• said condenser portion being coupled to said housing of said air duct.

A portable computer comprising:

• an enclosure having an air duct comprising a housing having internal fins, said air duct directing an air flow from an inlet port located near the center of said air duct to first and second exit ports located adjacent opposite end portions of said air duct, said air duct having a substantially equal width as said enclosure, said enclosure comprising first, second and third sides;
• an air flow generator coupled to said inlet port for producing said air flow;
• and
• heat transfer means thermally coupling a heat generating component located within said enclosure to said air duct housing.