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US 5,966,066 AGranted
Micromechanical memory sensor
AssigneeCase Western Reserve University
InventorsMehran Mehregany, Kenneth G. Goldman, Vijayakumar R. Dhuler
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Abstract
A micromechanical memory sensor. The sensor comprises a latch member mechanically latching upon detection of a threshold value of a variable condition and circuitry for detecting such latching. A sensor further includes a resetting mechanism for electrically unlatching the latch member whereby the sensor latched purely mechanically is electrically reset for repeat use.
Claims4
A micromechanical sensor comprising:
- a mechanical latch being latched upon detection of a threshold value of a variable temperature condition, latching occurring by movement of components of the latch induced by the variable temperature condition;
- a readout mechanism operatively connected to the latch for detecting whether the latch is latched;
- and
- a resetting mechanism operatively connected to the latch electrically unlatching the latch by inducing movement of the components electrically whereby the sensor latched purely mechanically is electrically reset for repeat use.
1 more element
A micromechanical memory sensor comprising:
- a latch member having a sensing mechanism and a resetting mechanism mechanically latching upon detection of a predetermined temperature extreme;
- a readout mechanism operatively connected to the latch member for detecting whether the latch member is latched, and,
- a mechanism operatively connected to the latch member for electrically resetting the latch member.
A micromechanical memory sensor comprising:
- a first beam supported at a first end thereof by a first support and having a second end;
- a second beam supported at a first end thereof by a second support and having a second end having flexibility greater than the first beam, the first and second beam being disposed in a first arrangement so that the second end of the second beam engages a first surface of the first beam at the second end of the first beam,
- an increase in ambient temperature facilitating a first deflection in the first beam and a second deflection in the second beam in accordance with the difference in the flexibility of the first and second beams, and,
- a decrease in the ambient temperature facilitating movement of the first and second beams to a second arrangement, the second beam engaging a second surface of the first beam in the second arrangement so that the second beam is latched on the first beam;
- a readout mechanism positioned on the sensor to detect whether the second beam is latched on the first beam;
- and,
- a means for electrically resetting the first and second beams to the first arrangement.
4 more elements
A micromechanical memory sensor comprising:
- a first beam formed of a first material having a first thermal coefficient of expansion and a second material having a second thermal coefficient of expansion, the second coefficient being different than the first coefficient, the first and second materials being disposed in layers having a terminal end and formed on a substrate, the substrate extending beyond the terminal end;
- and,
- a second beam having flexibility greater than the first beam disposed in a first arrangement such that the second beam opposes a first surface of the substrate, the second beam being formed of the first material and the second material,
- an increase in ambient temperature facilitating a first deflection in the first beam and a second deflection in the second beam in accordance with the difference in the first and second coefficients and the flexibility of the first and second beams, and,
- a decrease in the ambient temperature facilitating movement of the first and second beams to a second arrangement, the second beam engaging a second surface of the substrate in the second arrangement so that the second beam is latched on the first beam;
- and,
- a means for electrically resetting the first and second beams to the first arrangement.
4 more elements
Dependencies are inferred from the claim text.