Back to results
US 5,966,060 AGranted
Surface acoustic wave apparatus having an interdigital transducer ground electrode connected to multiple package grounds
AssigneeMurata Manufacturing Co., Ltd.
InventorKatsuhiro Ikada
Life of this patent
Estimating the term…
Abstract
A surface acoustic wave apparatus includes first and second longitudinally-coupled resonator filters disposed on a surface-wave board. In each longitudinally-coupled resonator filter, the ground electrodes of IDTs disposed at opposite sides of the center IDT and adjacent to reflectors are connected to different ground electrodes located on the same layer in the package, with at least two bonding wires.
Claims20
A surface acoustic wave apparatus comprising:
- a resonator filter chip including a surface-wave board, at least three interdigital transducers disposed on said surface-wave board and each of the interdigital transducers including a ground electrode, and a pair of reflectors disposed at opposite sides of an area where said three interdigital transducers are located;
- a multilayer package having a plurality of electrodes arranged such that the resonator filter chip is accommodated in the multilayer package;
- wherein
- the ground electrode of at least one of the interdigital transducers located adjacent to said reflectors is connected to at least two different ground electrodes which are located on a common layer of said package.
1 more element
A surface acoustic wave apparatus comprising:
- a resonator filter chip including at least two longitudinally-coupled resonators and a surface-wave board on which the at least two longitudinally-coupled resonators are disposed, the at least two longitudinally-coupled resonators being electrically coupled to each other, each of the at least two longitudinally-coupled resonators including at least three interdigital transducers disposed on said surface-wave board and a pair of reflectors disposed at opposite sides of an area where said three interdigital transducers are located, each of the interdigital transducers including a ground electrode;
- a multilayer package having a plurality of electrodes arranged such that the resonator filter chip is accommodated in the multilayer package;
- wherein
- the ground electrode of at least one of the interdigital transducers located adjacent to said reflectors in one of the at least two resonators is connected to at least two different ground electrodes which are located on a common layer of said package.
1 more element
A surface acoustic wave apparatus comprising:
- a resonator filter chip including a surface-wave board, at least three interdigital transducers disposed on said surface-wave board and each of the interdigital transducers including a ground electrode, and a pair of reflectors disposed at opposite sides of an area where said three interdigital transducers are located;
- a multilayer package having a plurality of electrodes arranged such that the resonator filter chip is accommodated in the multilayer package;
- wherein
- at least one of the ground electrodes of the interdigital transducers located adjacent to said reflectors is connected to at least two different ground electrodes which are located on a layer of said package.
1 more element
Dependencies are inferred from the claim text.