Method and apparatus for facilitating detection of solder opens of SMT components
AssigneeIntel Corporation
InventorsThomas Rampone, George Arrigotti
Life of this patent
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Abstract
A split-pad land pattern configured to facilitate electrical testing of an interconnection between a single electrical contact of a surface mount technology component and a printed circuit board. The split-pad land pattern comprises at least one split mounting pad including at least a first and second mounting pads coupled to a single electrical contact. The mounting pads are further coupled to corresponding access pads so that a first access pad is coupled to the first mounting pad while a second access pad is coupled to the second mounting pad. Electrical testing of the single electrical contact is possible through the completed circuit between the two access pads.
Claims26
A land pattern circuit comprising:
- at least one split-mounting pad to be permanently coupled to a single electrical contact of a surface mount technology (SMT) component, the split-mounting pad comprises a plurality of mounting pads including at least a first mounting pad dedicated for testing of the single electrical contact and a second mounting pad to the couple SMT component with another component, the first mounting pad and the second mounting pad are spatially separated from each other.
A land pattern circuit that facilitates electrical testing of an interconnection between a single electrical contact of an empty surface mount technology (SMT) socket and a substrate board, comprising:
- access means for receiving a plurality of probes used to perform the electrical testing;
- and
- split mounting means, being coupled to said access means and the single electrical contact of the empty SMT socket, for electrically coupling the SMT socket to the substrate board and for enabling the interconnection to be individually tested without placement of a SMT component into the SMT socket.
Placed on a substrate board, a split mounting pad that facilitates electrical testing of an interconnection of the substrate board with a single electrical contact of a component, comprising:
- a plurality of mounting pads being made of an electrically conductive material and to be coupled to the single electrical contact upon placement of the component onto the substrate board, said plurality of mounting pads include at least a first mounting pad dedicated for testing of the single electrical contact and a second mounting pad to couple the component with another component on the substrate board, the first and second mounting pads being separated by a gap sufficient in distance to prevent electrical conduction therebetween.
A printed circuit board implemented with a surface mount technology component including a plurality of electrical contacts, the printed circuit board comprising:
- a substrate board including a plurality of traces;
- a plurality of split mounting pads disposed on a first surface of the substrate board, a first split mounting pad of the plurality of split mounting pads includes a plurality of mounting pads for coupling with an electrical contact of the electrically-isolated surface mount technology component, said plurality of mounting pads includes at least a first mounting pad and a second mounting pad;
- a first access pad coupled to the first mounting pad through a first trace of the plurality of traces;
- and
- a second access pad coupled to the second mounting pad through a second trace of the plurality of traces.
A land pattern circuit that facilitates electrical testing of an interconnection between a single electrical contact of an empty surface mount technology (SMT) socket and a substrate board, comprising:
- a plurality of mounting pads being made of an electrically conductive material and to be coupled to the single electrical contact upon placement of the SMT socket onto the substrate board, said plurality of mounting pads include at least a first mounting pad and a second mounting pad being separated from the first mounting pad by a gap sufficient in distance to (i) prevent electrical conduction between the plurality of mounting pads and (ii) enable the interconnection to be individually tested without placement of a SMT component into the SMT socket.
Implemented on a substrate board, a land pattern circuit comprising:
- a split mounting pad disposed on a first surface of the substrate board, the split mounting pad including a plurality of mounting pads for coupling with an electrical contact of the electrically-isolated surface mount technology component, said plurality of mounting pads includes at least a first mounting pad and a second mounting pad;
- a first access pad coupled to the first mounting pad through a first trace;
- and
- a second access pad coupled to the second mounting pad through a second trace.
Dependencies are inferred from the claim text.