Structure of a semiconductor package including chips bonded to die bonding pad with conductive adhesive and chips bonded with non-conductive adhesive containing insulating beads
AssigneeSamsung Electronics Co., Ltd.
InventorsShi-baek Nam, Seung-kon Mok, Dae-hoon Kwon
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Abstract
In a semiconductor package which includes a plurality of semiconductor chips of different kinds, some of the chips are bonded to die bonding pad by means of a conductive adhesive, while the other chips are bonded by means of a non-conductive adhesive that contains highly insulating beads. Encapsulation of the package is by a molding compound. A nitride film or an organic insulating film is disposed on a back side of the chips bonded by the non-conductive adhesive to improve the withstand voltage between these chips and the die pad.
Claims15
A semiconductor package comprising:
- a) at least one first semiconductor chip bonded to a die pad by an electrically conductive adhesive;
- b) at least one second semiconductor chip bonded to said die pad by an insulating adhesive;
- c) a plurality of inner leads connected by metal wires to said at least one first semiconductor chip and said at least one second semiconductor chip;
- d) a nitride film disposed on a back side of a said at least one second semiconductor chip to improve the withstand voltage between said at least one second semiconductor chip and said die pad;
- and
- e) said insulating adhesive comprising a plurality of insulating beads having a predetermined diameter to improve the withstand voltage between said at least one second semiconductor chip and said die pad by controlling the thickness of said insulating adhesive.
semiconductor package comprising:
- a) at least one first semiconductor chip bonded to a die pad by an electrically conductive adhesive;
- b) at least one second semiconductor chip bonded to said die pad by an insulating adhesive;
- c) a plurality of inner leads connected by metal wires to said at least one first semiconductor chip and said at least one second semiconductor chip;
- and
- d) a nitride film disposed on a back side of said at least one second semiconductor chip to improve the withstand voltage between said at least one second semiconductor chip and said die pad.
A semiconductor package comprising:
- a) at least one first semiconductor chip bonded to a die pad by an electrically conductive adhesive;
- b) at least one second semiconductor chip bonded to said die pad by an insulating adhesive;
- c) a plurality of inner leads connected by metal wires to said at least one first semiconductor chip and said at least one second semiconductor chip;
- d) an organic insulating film disposed on a back side of said at least one second semiconductor chip to improve the withstand voltage between said at least one said semiconductor chip and said die pad;
- and
- e) said insulating adhesive comprising a plurality of insulating beads having a predetermined diameter to improve the withstand voltage between said at least one said semiconductor chip and said die pad by controlling the thickness of said insulating adhesive.
Dependencies are inferred from the claim text.