Pass card having a semiconductor chip module attached by a microencapsulated adhesive
AssigneeOrga Kartensysteme GmbH
InventorGerd Mederski
Life of this patent
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Abstract
A pass card having a card body with a cavity therein, a module with a semiconductor chip implanted permanently in the cavity of the card body, and a micro-encapsulated adhesive for fixing a nonconductive plastic substrate of the module in the card body.
Claims11
A pass card, comprising:
- a card body having a cavity therein;
- a module with a semiconductor chip implanted permanently in the cavity of the card body, the module having a non-conductive plastic substrate;
- and micro-encapsulated adhesive means for fixing only the non-conductive plastic substrate of the module to the card body, the adhesive means including micro-capsules containing adhesive.
A module with a semiconductor chip for implantation into a card body of a smart card, comprising a micro-encapsulated adhesive on a side of the module that is to be connected to the card body.
A card body for a smart card, which card body is configured to have a cavity for accommodating a module with a semiconductor chip, the card body comprising a micro-encapsulated adhesive in a region of the cavity.
Dependencies are inferred from the claim text.