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AssigneeDsm N.V.
InventorsCornelis E. Koning, Petronella M. Knape, Robert M. Leeuwendal, Josefina M. A. Schiffer
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The invention relates to electrical and electronic components made of a polyamide composition and possessing an improved resistance under soldering conditions, particularly when the surface mounting technique is used. This is achieved by using a polyamide composition whose main chain essentially consists of units derived from aliphatic dicarboxylic acids and diamines or .alpha.,.omega.-amino acids, and in which 1-40% of the chain units are derived from 1,6-cyclohexanedicarboxylic acid and an aliphatic diamine, or from 1,4-cyclohexanediamine and an aliphatic dicarboxylic acid. As a result, the temperature at which blisters are formed during soldering by the infrared method is 20-30.degree. C. higher than in the case of the homo-polyamide.
An electrical or electronic component made from a polyamide composition, wherein the polyamide therein has a main chain, said main chain of the polyamide consisting essentially of units derived from aliphatic dicarboxylic acids and aliphatic diamines or .alpha.,.omega.-amino acids, wherein from 1 to about 40% of the number of chain units are derived from 1,4-cyclohexanedicarboxylic acid and an aliphatic diamine, or from 1,4-and an aliphatic dicarboxylic acid.
A copolyamide consisting essentially of chain units derived from 1,4-tetramethylenediamine and adipic acid, wherein 1-40% of the chain units are derived from 1,4-tetramethylenediamine and 1,4 cyclohexanedicarboxylic acid, or from adipic acid and 1 ,4-cyclohexyldiamine.
Dependencies are inferred from the claim text.