Resin composition and resin-molded type semiconductor device

#1. Field of the Invention

#This invention relates to a resin composition and a resin-molded type semiconductor device wherein a semiconductor chip is sealed with the resin composition being cured.

#2. Description of the Related Art

#The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate presently preferred embodiments of the invention and, together with the general description given above and the detailed description of the preferred embodiments given below, serve to explain the principles of the invention.

#FIGURE is a longitudinal sectional view showing one example of the resin-molded type semiconductor device.

#This invention will be further explained in detail with reference to the following preferred embodiments.

#The resin composition according to a first embodiment of this invention is featured in that the resin composition comprises (a) polyarylene polyether represented by the general formula of Z.sub.1 -(polyarylene polyether) chain-Z.sub.1 ' (wherein Z.sub.1 and Z.sub.1 ' denote individually a monovalent organic group containing a cross-linkable unsaturated carbon-carbon linkage); and (b) an inorganic filler.

#The (a) component formed of polyarylene polyether can be represented by the general formula of Z.sub.1 -(O--Ar)n--OZ.sub.1 '. Herein Ar denotes bivalent aromatic group. This Ar may be a repetition of different kinds of aromatic groups. Specific examples of the (a) component are polyarylene polyethers represented by the following general formulas (1) to (8). Among them, the polyarylene polyethers represented by the general formulas (1), (6), (7) and (8) which do not contain an aliphatic group in the repetition moiety thereof are more preferable in view of the flame resistance thereof.