Use of silicone-modified epoxy resins as sealing compound
AssigneeRobert Bosch GmbH
InventorsWerner Pfander, Irene Jennrich, Richard Spitz, Uwe Koehler, Siegfried Schuler
Life of this patent
Estimating the term…
Abstract
The use of a thermosetting epoxy resin blend as a casting compound for electronic or electrotechnical components. The blend contains a silicone-modified epoxy resin in which organic components containing epoxy groups are chemically bonded to silicone components, and a mineral filler, optionally silanized, that regulates the thermal expansion behavior, in an amount of 40 wt % to 75 wt %, based on the thermosetting epoxy resin blend. The thermosetting epoxy resin blends are used to particular advantage for casting diodes.
Claims8
A casting compound for an electrical component, the casting compound comprising a thermosetting epoxy resin blend containing:
- a first epoxy resin having a chemically bonded linear organopolysiloxane group, the first epoxy resin being an elastomer, the first epoxy resin having at least one bifunctional bridge molecule with at least one oxygen-containing group between a functional oxirane group and the linear organopolysiloxane group;
- a second epoxy resin based on at least one of the group consisting of a polyvalent aromatic group and a cycloaliphatic group;
- a hardener;
- and
- a mineral filler.
Dependencies are inferred from the claim text.