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AssigneeSandia Corporation
InventorsRiley D. Kilgo, Richard K. Brow, Larry Kovacic
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The present invention provides a glass composition for hermetically sealing to high thermal expansion materials such as aluminum alloys, stainless steels, and copper alloys, which includes between about 10 and about 25 mole percent Na.sub.2 O, between about 10 and about 25 mole percent K.sub.2 O, between about 4 and about 15 mole percent Al.sub.2 O.sub.3, between about 35 and about 50 mole percent P.sub.2 O.sub.5, B.sub.2 O.sub.3 in a concentration not exceeding 10 mole percent, and MXO in a concentration not exceeding 12 mole percent, wherein MXO is a metal oxide selected from the group consisting of PbO, BaO, CaO and MgO or a mixture thereof. This composition is suitable to hermetically seal to components for use in RF-interconnection applications.
A glass composition for hermetically sealing to aluminum or aluminum alloys consisting essentially of between about 10 and about 25 mole percent Na.sub.2 O, between about 10 and about 25 mole percent K.sub.2 O, between about 4 and about 15 mole percent Al.sub.2 O.sub.3, between about 35 and about 50 mole percent P.sub.2 O.sub.5, between 0 and about 10 mole percent B.sub.2 O.sub.3, and MXO in a concentration not exceeding 12 mole percent, wherein MXO is a metal oxide selected from the group consisting of CaO, MgO and a mixture thereof, wherein said glass composition has a dielectric constant less than 8, a thermal expansion coefficient between about 160.times.10.sup.-7 and 210.times.10.sup.-7 /.degree. C., and a dissolution rate in deionized water of less than approximately 6.times.10.sup.-7 g/cm.sup.2 -min.
A glass composition for hermetically sealing to aluminum or aluminum alloys consisting essentially of between about 10 and about 25 mole percent Na.sub.2 O, between about 10 and about 25 mole percent K.sub.2 O, between about 4 and about 15 mole percent Al.sub.2 O.sub.3, between about 35 and about 50 mole percent P.sub.2 O.sub.5, between 0 and about 10 mole percent B.sub.2 O.sub.3, and MgO in a concentration not exceeding 12 mole percent, wherein said glass composition has a dielectric constant less than 8, a thermal expansion coefficient between about 160.times.10.sup.-7 and 210.times.10.sup.-7 /.degree. C., and a dissolution rate in deionized water of less than approximately 6.times.10.sup.31 7 g/cm.sup.2 -min.
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