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US 5,965,278 AGranted
Method of making cathode targets comprising silicon
AssigneePPG Industries Ohio, Inc.
InventorsJames J. Finley, Thomas J. Waynar, Larry A. Miller
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Abstract
A method for bonding silicon-containing compositions to metal surfaces is disclosed wherein a coarse silicon-containing surface is arc-sprayed with a first adhesive layer, a second solderable layer, and a third solder layer, and the arc-sprayed surface is then soldered to the metal surface. The method is particularly useful for producing silicon-containing targets for cathode sputtering.
Claims5
A method for bonding a silicon-containing composition to a metal surface comprising the steps of:
- a. providing a coarse silicon-containing surface;
- b. arc-spraying a metal adhesion layer onto the coarse silicon-containing surface;
- c. arc-spraying a solderable layer onto the metal adhesion layer;
- d. arc-spraying a solder layer onto the solderable layer;
- e. soldering the solder layer to the metal surface, and
- f. arc-spraying a metal layer onto the metal surface to be bonded to the silicon-containing surface.
3 more elements
An article for cathode sputtering silicon-containing compositions comprising:
- a. a silicon-containing composition;
- and
- b. on at least one surface portion thereof an arc-sprayed layer of metal;
- c. an arc-sprayed solderable layer on the arc-sprayed layer of metal;
- d. an arc-sprayed layer of solder on the solderable layer;
- e. a metal backing plate bonded to said solder layer, wherein the metal is selected from the group consisting of copper, aluminum, titanium and molybdenum and wherein a surface of said metal backing plate is arc-sprayed with a layer of metal selected from the group consisting of copper, tin, indium and alloys thereof.
3 more elements
Dependencies are inferred from the claim text.