Liquid application method and application apparatus

A method of applying a liquid comprising the steps of:

• supplying an application liquid through a horizontal linear application supply means of an application head;
• causing a linear application liquid bead to form in a space between the application liquid supply means and a rigid substrate of planar sheet form located adjacent but spaced from said application liquid supply means;
• causing said substrate to move relative to said application liquid bead in an upward direction across a direction in which said application liquid bead extends;
• and
• bringing said application liquid bead into contact with a planar application surface of said substrate while said application liquid is supplied from said application liquid supply means, to form an application layer on said application surface in accordance with said relative movement of said substrate;
• said liquid application method further comprising the steps of:
• providing said application liquid supply means in an upward-pointing direction;
• determining relative positioning between said substrate and said application head in such a manner that said substrate is positioned in an inclined state wherein said planar application surface is directed downwards toward said application liquid supply means, and forms a constant angle of inclination, before an application of liquid begins, and said application liquid supply means is positioned adjacent to said application surface of the substrate in the vicinity of an uppermost edge thereof;
• producing an upper meniscus of said application liquid bead facing a higher side of said inclined substrate in said space between said application liquid supply means and said substrate, and a lower meniscus of said application liquid bead facing a lower side of said inclined substrate in said space, said upper meniscus having a greater height dimension than said lower meniscus;
• maintaining said upper and lower menisci by physical properties, including viscosity and surface tension, of the application liquid;
• causing said substrate to move along a predetermined linear path relative to said application head while maintaining said angle of inclination relative to said application head in such a manner that said application liquid bead moves towards a lower edge of said substrate while maintaining said inclined state of said substrate and said relation between the menisci of said application liquid;
• and
• causing the application layer of the application liquid to flow down along said planar application surface towards said lower edge of the substrate, thus smoothing the surface of the application layer.