Hybrid inorganic-organic composite for use as an interlayer dielectric

Abstract

Three-phase composite materials system having a low dielectric constant and physico-chemical properties suitable for IC fabrication conditions, and a method for making such materials, are disclosed. The three-phase composite material includes an organic phase, an inorganic phase and a void phase. The organic phase is in the form of an organic polymer matrix, the void phase is represented by microporosity present in the matrix, and the inorganic phase is implemented as inorganic particles that are coupled, via a coupling agent, to the organic matrix. The low dielectric constant of the composite is attributable to the microporous organic polymer matrix. The inorganic particles are responsible, at least in part, for providing thermal stability and other required physico-chemical properties to the composite.

Dependencies are inferred from the claim text.