Blow molding apparatus for a chip carrier maker

A blow molding apparatus for a chip carrier maker, said blow molding apparatus being adapted to form a longitudinal row of spaced-apart recesses in a flat thermoplastic strip and including a stationary machine frame, a heating device mounted on the frame for heating the strip, a lower mold disposed on the frame and having a mold cavity unit therein, and an upper mold which is disposed on the frame, one of the upper and lower molds being movable toward the other one so as to clamp the strip between the upper and lower molds, thereby establishing an air-tight seal between the strip and the upper mold, the upper mold having a bottom surface formed with an air chamber which is aligned with the mold cavity unit of the lower mold, and an air passage unit which is formed therethrough and which is in fluid communication with the air chamber so that compressed air can be introduced into the air chamber via the air passage unit, thereby pressing the strip into the mold cavity unit after the strip is heated and softened by the heating device and subsequently forming the recesses in the strip, wherein the improvements comprise the heating device including a heating member fixed in the air chamber to heat air in the air chamber to a temperature at which the strip is softened, the upper mold including an upper cooling unit located around the air chamber to cool the upper mold after the recesses are formed in the strip.