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US 5,965,043 AGranted
Method for using ultrasonic treatment in combination with UV-lasers to enable plating of high aspect ratio micro-vias
AssigneeW. L. Gore & Associates, Inc.
InventorsDavid B. Noddin, Robin E. Gorrell, Michael R. Leaf
Life of this patent
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Abstract
A method of forming a via in a laminated substrate by forming ablated material by laser drilling a via in a laminated substrate. The ablated material is deposited on a sidewall of the via. An ultrasonic treatment is applied to the drilled substrate thereby removing ablated material redeposited on sidewalls of the via.
Claims31
A method of forming a via in a laminated substrate having an exposed surface, comprising the steps of:
- applying a polymeric photo-absorptive layer on the exposed surface, the photo-absorptive layer having a thickness between 5 .mu.m and 50 .mu.m inclusive;
- forming ablated material by laser drilling a via in a laminated substrate;
- redepositing the ablated material on a sidewall of the via;
- and
- applying an ultrasonic treatment, which includes de-ionized water, to the drilled substrate for a time duration in a range from about 5 to about 20 minutes thereby removing ablated material redeposited on the sidewall of the via.
2 more elements
Dependencies are inferred from the claim text.