Method and apparatus for adhesion of semiconductor substrate
AssigneeShin-Etsu Handotai Co., Ltd.
InventorHideoki Hirooka
Life of this patent
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Abstract
A method and apparatus for adhesion of a semiconductor substrate on a support block in a condition that there are no minute concave or convex portions on the semiconductor substrate are proposed and have features that not only is the semiconductor substrate supported at its periphery in a squeezing condition but a back pressure is also applied on the semiconductor substrate with an air bag in such a manner that a region of the air bag corresponding to the central region of the semiconductor substrate is most swelled out, so that the semiconductor substrate is curved and the central region of the semiconductor substrate is pressed to the support block and thereafter, the squeezing condition of the semiconductor substrate is released to make the semiconductor substrate adhered to the support block.
Claims3
An adhesion method for a semiconductor substrate on a support block with an adhesive material, is characterized in that not only is the semiconductor substrate supported at its periphery in a squeezing condition but a back pressure is also applied on the semiconductor substrate with an air bag in such a manner that a region of the air bag corresponding to the central region of the semiconductor substrate is most swelled out, so that the semiconductor substrate is curved and the central portion of the semiconductor substrate is pressed to the support block and that thereafter, the squeezing condition of the semiconductor substrate is released to make the semiconductor substrate adhered to the support block.
An adhesion method for a semiconductor substrate on a support block with an adhesive material, is characterized in that the semiconductor substrate is supported at its periphery in a squeezing condition, that the squeezing condition of the semiconductor substrate is released to have the semiconductor substrate fall on the support block by its self weight, that thereafter a back pressure is applied on the semiconductor substrate with an air bag in such a manner that a region of the air bag corresponding to the central region of the semiconductor substrate is most swelled out and that thereby the semiconductor substrate is made to adhere to the support block.
An adhesion apparatus for a semiconductor substrate on a support block with an adhesive material, comprising:
- a chuck for holding the semiconductor substrate at its periphery in a squeezing condition;
- chuck drive means for driving the chuck to convert between the squeezing condition of the chuck and a non-squeezing condition thereof;
- and an air bag for applying a back pressure on the semiconductor substrate, which is held by the chuck in a squeezing condition, in such a manner that a region of the air bag corresponding to the central region of the semiconductor substrate is most swelled out;
- and air bag inflating/contracting means for inflating or contracting the air bag.
Dependencies are inferred from the claim text.