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US 5,964,652 AGranted
Apparatus for the chemical-mechanical polishing of wafers
AssigneeSiemens Aktiengesellschaft
InventorsHanno Melzner, Hermann Wendt
Life of this patent
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Abstract
An apparatus for the chemical-mechanical polishing of wafers has a rotating disk provided with a polishing body, a supply device for a polishing fluid and a holding device for the wafer. An axis of the disk runs parallel to the surface of the wafer. A cylindrical edge surface of the disk is provided with the polishing body in such a way that a trench with a specific cross section can be made in the wafer.
Claims9
An apparatus for the chemical-mechanical polishing of wafers, comprising:
- a holding device for a wafer having a surface;
- a rotating disk having an axis running parallel to the surface of the wafer and having a cylindrical edge surface;
- a polishing body applied to said cylindrical edge surface of said disk for producing a trench with a specific cross section in the wafer;
- and
- a device for supplying a polishing fluid to said polishing body.
2 more elements
Dependencies are inferred from the claim text.