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US 5,964,397 AGranted
Passive alignment of components with micromachined tool
AssigneeAmerican Telephone and Telegraph Company
InventorMindaugas Fernand Dautartas
Life of this patent
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Abstract
A method of fabricating an electronic device uses a micromachined tool that has openings which receive and align components with respect to each other and a substrate. The tool has fiducial marks which align to fiducial marks on the substrate, thereby producing precise alignment of the tool and the substrate. The components are then inserted into the openings, thereby insuring their alignment with respect to the substrate.
Claims10
A method of manufacturing a device having at least a first component attached to a substrate comprising the steps of:
- aligning a tool with respect to said substrate, said tool and said substrate having mating fiducial marks for alignment, said tool having at least one opening which exposes at least a portion of said substrate, said at least one opening having inwardly sloping walls toward the substrate surface;
- inserting said at least first component into said at least one opening, said first component contacting said substrate and being aligned with respect to said substrate;
- attaching said at least a first component to said substrate;
- and
- removing said tool.
2 more elements
Dependencies are inferred from the claim text.