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US 5,964,210 AGranted
Apparatus and method for slicing a workpiece utilizing a diamond impregnated wire
AssigneeLaser Technology West Limited
InventorJohn B. Hodsden
Life of this patent
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AssigneeLaser Technology West Limited
InventorJohn B. Hodsden
Estimating the term…
An apparatus and method for slicing a workpiece, in particular, a polysilicon or single crystal silicon ingot, utilizing a diamond impregnated wire saw in which either the workpiece (or ingot) is rotated about its longitudinal axis or the diamond wire saw is rotated about the longitudinal axis of the workpiece as the diamond wire is driven orthogonally to the longitudinal axis of the workpiece and advanced from a position tangentially adjoining the outer diameter ("OD") of the ingot to a position tangential to its center or inner diameter ("ID"). In this manner, the diamond wire cuts through the workpiece at a substantially tangential point to the circumference of the cut instead of straight through up to the entire diameter of the piece and single crystal silicon ingots of 300 mm to 400 mm or more may be sliced into wafers relatively quickly, with minimal `kerf" loss and less extensive follow-on lapping operations.
A method for sectioning a substantially cylindrical crystalline workpiece comprising the steps of:
An apparatus for sectioning a substantially cylindrical crystalline workpiece comprising:
A semiconductor wafer made by a process comprising the steps of:
Dependencies are inferred from the claim text.