Bonded pin extrusion die and method
AssigneeCorning Incorporated
InventorsHarry A. Kragle, Floyd E. Stumpff
Life of this patent
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Abstract
A honeycomb extrusion die and a method of making the die are disclosed, the die being made by bonding a die discharge section formed as a separate pin array to a separate die body incorporating an array of feed channels, the pin array comprising a plurality of pins attached to and extending outwardly from a body-compatible pin support which is removed after bonding the pins to the body. The pins may be formed of hard wear materials, and may have any of a variety of cross-sectional shapes adapted to improve extrusion uniformity as well as to form honeycomb cells of a variety of different cross-sectional shapes.
Claims12
A method for making a honeycomb extrusion die which comprises the steps of:
- providing a die body having a die inlet face and a feedhole outlet face, the die body including an array of feed channels extending through the die body from the inlet face to feed channel openings on the outlet face;
- providing a pin array comprising a plurality of pins attached to and extending outwardly from a pin support layer, wherein (i) the pin array is formed by bonding into a unitary structure a plurality of individually formed pin members, (ii) the pins have pin root ends that collectively terminate in a common plane, and (iii) the pin support layer is formed of a material having a thermal expansion coefficient and high temperature creep behavior similar to that of the die body;
- assembling the die body and pin array so that the pin root ends are aligned with pin attachment points on the feedhole outlet face of the die body, the pin attachment points being located between the feed channel openings;
- bonding the pin root ends to the attachment points on the outlet face by heating the die body and pin array;
- and
- separating the pin support layer from the plurality of pins.
Dependencies are inferred from the claim text.