Fabrication method for semiconductor package substrate and semiconductor package
AssigneeLG Semicon Co., Ltd.
InventorSun Dong Kim
Life of this patent
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Abstract
A fabrication method for a chip package includes the steps of forming a first substrate having embedded leads, forming a second substrate with embedded leads and a central aperture therethrough, and attaching the second substrate to the first substrate to form a substrate with a recess for receiving a chip. A chip may then be mounted within the central aperture of the second substrate, on the first substrate, and bond pads of the chip may be attached to leads exposed on one of the first and second substrates with a plurality of metal wires. A resin may be molded over the device to protect the metal wires, the chip, and the leads.
Claims18
A method for making a component of a chip package, comprising the steps of:
- forming a first substrate having a plurality of embedded leads such that upper, lower and outer side surfaces of the leads are exposed;
- forming a second substrate having plurality of embedded leads and a hole in an interior portion thereof;
- and
- attaching the second substrate to the first substrate.
A method of forming a chip package, comprising the steps of:
- forming a first substrate having a plurality of embedded first leads;
- forming a second substrate having an aperture therethrough and having a plurality of second leads;
- attaching the second substrate to the first substrate;
- and
- mounting a chip on the first substrate such that it is within the aperture of the second substrate.
Dependencies are inferred from the claim text.