Semiconductor component and method of manufacture
AssigneeMotorola, Inc.
InventorBrian A. Webb
Life of this patent
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Abstract
A semiconductor component can be manufactured by providing a leadframe (12) with leads (13) and a flag (14) substantially coplanar with at least one of the leads (13) wherein the flag (14) has a hole (15). An electronic substrate (11) is adhered to the flag (14) wherein a perimeter of the electronic substrate (11) has bonding pads (21), wherein the bonding pads (21) face toward the flag (14), wherein the electronic substrate (11) covers the hole (15), and wherein the flag (14) is absent over the bonding pads (21). Next, the pads (21) are wire bonded to the leads (13), and then the electronic substrate (11) and the leadframe (12) are encapsulated with a packaging material (17) wherein the packaging material (17) has an opening (23) and is devoid of covering the hole (15) in the flag (14).
Claims17
A method of manufacturing a semiconductor component comprising:
- providing a leadframe having a flag with a hole;
- disposing an electronic chip over the flag wherein the electronic chip covers the hole;
- and
- disposing a packaging material around the electronic chip and the leadframe wherein the hole in the flag remains exposed after the disposing step.
A method of manufacturing a semiconductor component comprising:
- providing a leadframe having a flag with a hole;
- and
- disposing an electronic chip over the flag wherein the electronic chip covers the hole,
- wherein the step of disposing the electronic chip includes providing the electronic chip with a bonding pad at a periphery of the electronic chip wherein the flag is devoid of covering the bonding pad.
A method of manufacturing a semiconductor component comprising:
- providing a leadframe having a flag with a hole;
- disposing an electronic chip over the flag wherein the electronic chip covers the hole;
- and
- disposing a filter over the hole in the flag.
A method of manufacturing a semiconductor component comprising:
- providing a leadframe having a flag with a hole;
- disposing an electronic chip over the flat wherein the electronic chip covers the hole;
- and
- disposing a port over the hole in the flag.
A method of fabricating an electronic component comprising:
- providing a support substrate with an electrical coupling portion adjacent to a physical coupling portion having a hole;
- providing an electronic substrate having an electronic device;
- and
- physically coupling the electronic substrate to the physical coupling portion wherein the electronic substrate is located over the hole and wherein the electronic device is electrically coupled to the electrical coupling portion,
- wherein the step of physically coupling further comprises:
- aligning a central portion of the electronic substrate over the hole in the physical coupling portion of the support substrate;
- and
- using an adhesive to couple the electronic substrate to a perimeter of the physical coupling portion of the support substrate wherein the adhesive provides a gap between the central portion of the electronic substrate and a central portion of the physical coupling portion.
A method of fabricating an electronic component comprising:
- providing a support substrate with an electrical coupling portion adjacent to a physical coupling portion having a hole;
- providing an electronic substrate having an electronic device;
- physically coupling the electronic substrate to the physical coupling portion wherein the electronic substrate is located over the hole and wherein the electronic device is electrically coupled to the electrical coupling portion;
- and
- packaging the electronic substrate and the support substrate with an encapsulant wherein the encapsulant is devoid of completely covering the hole in the support substrate.
A method of fabricating an electronic component comprising:
- providing a support substrate with an electrical coupling portion adjacent to a physical coupling portion having a hole;
- providing an electronic substrate having an electronic device;
- physically coupling the electronic substrate to the physical coupling portion wherein the electronic substrate is located over the hole and wherein the electronic device is electrically coupled to the electrical coupling portion;
- and
- disposing a cover over the hole in the physical coupling portion.
A method of manufacturing an electronic component comprising:
- providing a leadframe having a flag and leads coplanar with the flag wherein the flag has a hole;
- adhering an electronic substrate to the flag wherein a surface of the electronic substrate has bonding pads, wherein the bonding pads face toward the flag, wherein the electronic substrate covers the hole, and wherein the flag is absent over the bonding pads;
- wire bonding the bonding pads to the leads;
- and
- encapsulating the electronic substrate and the leadframe with a molding compound wherein the molding compound is devoid of covering the hole in the flag.
Dependencies are inferred from the claim text.