Technique for determining semiconductor substrate thickness
AssigneeIntel Corporation
InventorPaul Winer
Life of this patent
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Abstract
The invention relates to a method of measuring the thickness of a semiconductor substrate. First, a semiconductor substrate having a thickness and a photocurrent generating structure is provided. Next, the semiconductor substrate is exposed to a light source and a current generated by the light source is measured across the photocurrent generating structure. Finally, the thickness of the semiconductor substrate is determined by the current measurement.
Claims14
A method of measuring a thickness of a semiconductor substrate having a photocurrent generating structure, comprising:
- exposing the semiconductor substrate to a light source;
- measuring a current generated by the light source across the photocurrent generating structure to determine a current measurement;
- and
- determining the thickness of the semiconductor substrate using the current measurement.
A method of reducing the thickness of a semiconductor substrate, comprising:
- exposing a semiconductor substrate having a first thickness and a photocurrent generating structure to a light source;
- measuring a first current generated by the light source across the photocurrent generating structure, the first current corresponding to the first thickness;
- and
- reducing the thickness of the semiconductor substrate to a second thickness, wherein the second thickness is determined by measuring a second current generated by the light source across the photocurrent generating structure.
A method of testing an integrated circuit having a photocurrent generating structure and devices formed on a first side of a semiconductor substrate, the method comprising:
- reducing a thickness of the semiconductor substrate from a second side of the semiconductor substrate at a point aligned with a device to be tested, wherein a reduction in thickness of the semiconductor substrate is measured by a current measurement derived by exposing the semiconductor substrate to a light source and measuring a current;
- exposing the device to be tested;
- and
- testing the device.
Dependencies are inferred from the claim text.