Semiconductor laser module
AssigneeNEC Corporation
InventorTomonari Kosugi
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AssigneeNEC Corporation
InventorTomonari Kosugi
Estimating the term…
A semiconductor laser module comprising a module package, a temperature control device, the lower plate of which is fixed to the inner bottom of the module package, a base plate fixed to the upper plate of the temperature control device, a semiconductor laser attached on the base plate for emitting laser light, an optical fiber fixed through the side wall of the module package, and a lens fixed on the base plate for optically connecting the semiconductor laser and the optical fiber. An upper plate of the temperature control device is fitted and fixed in a recess which is formed in the bottom of the base plate such that all side surfaces of the upper plate are in contact with all side surfaces of the recess. A lower plate of the temperature control device is fitted and fixed in a recess formed in the inner bottom of the module package.
A semiconductor module comprising:
A semiconductor laser module comprising:
Dependencies are inferred from the claim text.