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US 5,963,689 AGranted
Substrate edge connnector
AssigneeTelefonaktiebolaget LM Ericsson
InventorHjalmar Hesselbom
Life of this patent
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AssigneeTelefonaktiebolaget LM Ericsson
InventorHjalmar Hesselbom
Estimating the term…
A combined optical and electrical interconnection means for interconnection of in particular chip modules has an elastic layer of for instance silicone placed over the sharp edge or corner connecting surfaces where the interconnection is made. On the front surface the layer covers an end of an optical waveguide having a core and on the top surface the layer carries an electrically conducting area connected to an electric transmission line. The front surfaces are pressed against each other connecting the ends of the optical waveguides. On the top surface the conducting area is in contact with interconnected electrically conducting areas on a surface of a connector strip. This interconnection structure is able to connect densely located electrical lines and optical waveguides not requiring any fan-out configuration. It is particularly suited for interconnecting compact multi-chip modules and similar devices.
A combined electrical and optical edge contact for compact connection of a part to another part, the parts comprising electrical conductors and/or optical waveguides, the edge contact comprising a layer of an elastic, optically transparent material applied to a first surface of a part, which for interconnection is to be located at a corresponding first surface of another part, the layer being located to cover an end surface of an optical waveguide terminating at the surface, wherein the layer carries an exposed, electrically conducting area connected to an electrical conductor on that part, where the layer is located.
A method of manufacturing an interconnection for interconnecting electrical conductors and optical wave guides located on two different parts, in particular two different semiconducting substrates, comprising the steps of:
Dependencies are inferred from the claim text.